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  this is information on a product in full production. december 2012 doc id 023822 rev 1 1/9 9 ESDAVLC6-1BV2 single line low capacitance transil? for esd protection datasheet ? production data features pcb area: 0.09 mm2 bidirectional device low capacitance: 8 pf max. minimum breakdown voltage v br = 6 v low leakage current: lower than 50 na at 3 v rohs compliant applications where transient over voltage protection in esd sensitive equipment is required, such as: portable multimedia devices and accessories mid, netbooks and notebooks digital cameras and camcorders communication systems smart phones and accessories description the ESDAVLC6-1BV2 is a single line bidirectional transil diode designed specially for the protection of integrated circuits into portable equipment and miniaturized electronics devices subject to esd transient overvoltage. the device is ideal for applications where both reduced printed circuit board space and high esd protection level are required. tm: transil is a trademar k of stmicroelectronics figure 1. functional diagram st01005 ESDAVLC6-1BV2 pin1 www.st.com
characteristics ESDAVLC6-1BV2 2/9 doc id 023822 rev 1 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 12 15 kv i pp peak pulse current (8/20 s) (1) 2.5 a p pp peak pulse power (8/20 s) (1) 45 w t j operating temperature range -55 to +150 c t stg storage temperature range - 65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. v i v cl v cl v br v br v rm v rm i rm i pp slope: 1/r d symbol p arameter v = breakdown voltage v = stand-off voltage v = clamping voltage i = peak pulse current br rm cl pp i = leakage current @ v rm rm = line capacitance c line r = dynamic resistance d table 2. electrical characteristics (values, t amb = 25 c) symbol parameter test conditions value unit min. typ. max. v br breakdown voltage i r = 1 ma 6 v i rm leakage current v rm = 3 v 50 na v cl clamping voltage i pp = 1 a, 8/20 s 12 v i pp = 2.5 a maximum, 8/20 s 18 c line line capacitance, i/o to gnd v r = 0 v, f = 1 mhz, v osc = 30 mv 7.5 8 pf
ESDAVLC6-1BV2 characteristics doc id 023822 rev 1 3/9 figure 3. esd response to iec 61000-4-2 (typical values, +8 kv contact discharge) figure 4. esd response to iec 61000-4-2 (typical values, -8 kv contact discharge) 10 v/div 20 ns/div v : esd peak voltage v :clamping voltage at 30 ns v :clamping voltage at 60 ns v :clamping voltage at 100 ns pp cl cl cl 1 2 3 4 49.7 v 1 29.3 v 2 20.3 v 13.8 v 4 3 2 10 v/div 20 ns/div v : esd peak voltage v :clamping voltage at 30 ns v :clamping voltage at 60 ns v :clamping voltage at 100 ns pp cl cl cl 1 2 3 4 -50.8 v 1 -19.4 v -29.7 v 3 -13.1 v 2 4 figure 5. s21 attenuation measurement figure 6. junction capacitance versus reverse applied voltage (typical values) 100k 1m 10m 100m 1g 10g -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 s21 f (hz) s21 (db) c (pf) 0 1 2 3 4 5 6 7 8 9 10 0123456 vr(v) f=1 mhz v osc = 30 mv rms t j = 25 c io/gnd
ordering information scheme ESDAVLC6-1BV2 4/9 doc id 023822 rev 1 2 ordering information scheme figure 7. ordering information scheme esda vlc 6 - 1 b v 2 esd array very low capacitance breakdown voltage 6 package = 6 v min. v = st01005 package 2 = 2 pads b = bidirectional number of lines directional
ESDAVLC6-1BV2 package information doc id 023822 rev 1 5/9 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. package dimensions figure 9. footprint recommendation 50 m 50 m 50 m 50 m 75 m 75 m 200 m 200 m 20 205 m 20 25 m 10 450 m 20 b= 225 m c = 50 m d = 125 m e= 125 m f = 100 m g = 500 m h = 25 m i = 112.5 m j = 325 m a = 225 m
recommendation on pcb assembly ESDAVLC6-1BV2 6/9 doc id 023822 rev 1 4 recommendation on pcb assembly 4.1 stencil opening design stencil opening thickness: 80 m figure 10. recommended stencil window position 4.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. solder paste with fine particles: type 4 (powder particle size 20-38 m per ipc j-std-005). 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. tolerance of 0.02 mm is recommended. 225 160 160 125 50 225 62.5 32.5 20 45 32.5 pcb lands solder lands stencil lands
ESDAVLC6-1BV2 recommendation on pcb assembly doc id 023822 rev 1 7/9 4. 1.0 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 4.5 reflow profile figure 11. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ordering information ESDAVLC6-1BV2 8/9 doc id 023822 rev 1 5 ordering information 6 revision history table 3. ordering information order code marking weight base qty delivery mode ESDAVLC6-1BV2 no marking 0.041 mg 20 000 tape and reel table 4. document revision history date revision changes 05-dec-2012 1 first issue
ESDAVLC6-1BV2 doc id 023822 rev 1 9/9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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